Multi-Layer Ceramic Electronic Component and Method of Producing the Same

ABSTRACT

There is provided a multi-layer ceramic electronic component includes a ceramic body, an end external electrode unit, a side face external electrode unit. The ceramic body includes a pair of end faces, a pair of first side faces, and a pair of second side faces all of which are faced each other, respectively. The ceramic body includes a plurality of ceramic layers and an internal electrode unit. A plurality of the ceramic layers extend along a pair of the first side faces, and are laminated along a pair of the second side faces. The internal electrode unit includes first and second internal electrodes disposed alternately between a plurality of the ceramic layers, the first internal electrodes are drawn to both ends of a pair of the end faces, and the second internal electrodes are dawn to both ends of a pair of the second side faces. The end external electrode unit is connected to the first internal electrodes. The side face external electrode unit goes around from one of a pair of the first and second side faces to the other and are connected directly or indirectly each other at the other. There is also provided a method of producing the same.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit under 35 U.S.C. §119 of JapanesePatent Application Nos. 2015-245923, filed Dec. 17, 2015 and2015-148128, filed Jul. 27, 2015, which are herein incorporated byreference in their entirety.

BACKGROUND OF THE INVENTION

The present invention relates to a multi-layer ceramic electroniccomponent and a method of producing the same.

A through-type multi-layer ceramic capacitor is one of multi-layerceramic electronic components, and is known as a multi-layer ceramiccapacitor that reduces inductance components. In general, thethrough-type multi-layer ceramic capacitor includes end face externalelectrodes that connect internal electrodes drawn to end faces, and sideface external electrodes that connect internal electrodes drawn to sidefaces.

The through-type multi-layer ceramic capacitor is mounted on a componentpackaging substrate or a built-in component substrate. For example, whenthe through-type multi-layer ceramic capacitor is mounted on a built-incomponent substrate having vias (through-hole electrodes), side faceexternal electrodes are preferably connectable to the vias. Suchconfiguration is feasible to provide not two side faces to which theinternal electrodes are drawn, but all four side faces with the sideface external electrodes.

Japanese Patent Application Laid-open No. 2014-27077 discloses atechnology that provides four side faces of a through-type multi-layerceramic capacitor with side face external electrodes. In the technology,an electrical conductive paste is applied and baked to each of the fourside faces to form side face external electrodes. Specifically, in thetechnology, the electrical conductive paste is applied to go around theside faces adjacent to each side face in order to ensure reliability.

BRIEF SUMMARY

In the technology disclosed in the above-described literature, theelectrical conductive paste is overlapped doubly beyond ridgesconnecting each side face. This results in excess electrical conductivepaste in the vicinity of the ridges, and the electrical conductive pastespreads to the end faces of the ridges. Therefore, in a through-typemulti-layer ceramic capacitor provided by the technology, side faceexternal electrodes are easily widen in the vicinity of the ridges.

If there are wide side face external electrodes, a distance between anend face external electrode and a side face external electrode becomesshort. This may easily cause insulation failure of the through-typemulti-layer ceramic capacitor, for example, in a damp heat test.

In view of the circumstances as described above, an object of thepresent invention is to provide a multi-layer ceramic electroniccomponent where insulation failure less occurs and a method of producingthe same.

In order to achieve the object, a multi-layer ceramic electroniccomponent according to an embodiment of the present invention includes aceramic body, an end external electrode unit, a side face externalelectrode unit.

The ceramic body includes a pair of end faces, a pair of first sidefaces, and a pair of second side faces all of which are faced eachother, respectively. The ceramic body includes a plurality of ceramiclayers and an internal electrode unit. A plurality of the ceramic layersextend along a pair of the first side faces, and are laminated along apair of the second side faces. The internal electrode unit includesfirst and second internal electrodes disposed alternately between aplurality of the ceramic layers, the first internal electrodes are drawnto both ends of a pair of the end faces, and the second internalelectrodes are dawn to both ends of a pair of the second side faces.

The end external electrode unit is connected to the first internalelectrodes.

The side face external electrode unit goes around from one of a pair ofthe first and second side faces to the other and are connected directlyor indirectly each other at the other.

By the configuration, only one of the first and second side faceexternal electrodes is disposed in the vicinity of the ridges thatconnect the first and second side faces of the ceramic body. In otherwords, the side face external electrodes do not overlap beyond ridges ofthe first and second side face external electrodes. Accordingly, it canprevent the widths of the side face external electrode unit fromwidening in the vicinity of the ridges. The configuration can providesthe multi-layer ceramic electronic component where insulation failureless occurs.

The first and second side face external electrodes may go around from apair of the first side faces to a plurality of the second side faces,and may be connected each other at a pair of the second side faces.

By the configuration, only any one of the first and second side faceexternal electrodes where no internal electrode unit is drawn isdisposed. Accordingly, the flatness of the side face external electrodesis not degraded. In this manner, when the multi-layer ceramic electroniccomponent is mounted such that the first side faces are faced to themounting surface of the substrate, the multi-layer ceramic electroniccomponent can keep a proper attitude.

Any one of the first and second side face external electrodes may beconnected to a via formed on a built-in component substrate in any oneof a pair of the first side faces.

By the configuration, the multi-layer ceramic electronic componentmounted to the built-in component substrate can keep a proper attitude,and the side face external electrodes can be easily connected to the viaof the built-in component substrate.

Any one of the first and second side face external electrodes may beconnected to all of the second internal electrodes not via the other ina pair of the second side faces.

By the configuration, the second internal electrodes drawn to a pair ofthe second side faces are collectively connected by any of the first andsecond side face external electrodes. In this manner, the secondinternal electrodes and the side face external electrodes can beconnected more reliably.

The side face external electrode unit may further include a third sideface external electrode that connects the first side face externalelectrode and the second side face external electrode.

By the configuration, the use of the third side face external electrodeallows a go-around amount of the first and second side face externalelectrodes to be small, thereby easily forming the first and second sideface external electrodes.

The first and second side face external electrodes may go around from apair of the first side faces to a pair of the second side faces, and maybe connected each other at a pair of second side faces.

The third side face external electrode may be connected to the secondinternal electrode.

By the configuration, the second internal electrodes drawn to a pair ofthe second side faces are collectively connected by the third side faceexternal electrodes. In this manner, the second internal electrodes andthe side face external electrodes can be connected more reliably.

At least one of widths of the first, second, and third side faceexternal electrodes may be relatively narrow in a directionperpendicular to a pair of the end faces.

A width of the third side face external electrode may be narrower thanwidths of the first and second side face external electrodes in adirection perpendicular to a pair of the end faces.

By the configuration, by forming a relatively narrow width on the sideface external electrode unit, distances between the side face externalelectrode unit and the end face external electrodes can be widen in thepart of interest. In this way, a short circuit between the side faceexternal electrode unit and the end face external electrodes can beprevented.

In addition, by relatively widen the width of the side face externalelectrode unit connected to the mounting surface of the substrate, agood connection between the side face external electrode unit and themounting surface of the substrate can be easily provided.

A thickness in a direction perpendicular to a pair of first side facesmay be 50% or less of a width in a direction perpendicular to a pair ofsecond side faces in the ceramic body.

A thickness of the ceramic body in a direction perpendicular to a pairof the first side faces may be 80% or less of a width of the side faceexternal electrode unit in a direction perpendicular to a pair of theend faces.

By the configurations, as a go-around amount of the first and secondside face external electrodes is small, the side face external electrodeunit can be easily formed.

In a method of producing a multi-layer ceramic electronic componentaccording to an embodiment of the present invention, a ceramic bodyincluding a pair of end faces, a pair of first side faces, and a pair ofsecond side faces all of which are faced each other is prepared. Theceramic body has a plurality of ceramic layers and an internal electrodeunit. A plurality of the ceramic layers extend along a pair of the firstside faces and are laminated along a pair of the second side faces. Theinternal electrode unit has first and second internal electrodesdisposed alternately between a plurality of the ceramic layers, thefirst internal electrodes are drawn to both ends of a pair of the endfaces, and the second internal electrodes are dawn to both ends of apair of the second side faces.

An end external electrode unit connected to the first internalelectrodes are disposed at the both ends.

There is disposed a side face external electrode unit connected to thesecond internal electrodes and having first and second side faceexternal electrodes that go around from one of a pair of the first andsecond side faces to the other and are connected directly or indirectlyeach other at the other.

A third side face external electrode that connects the first and secondside face external electrodes to the other in a pair of the first andsecond side faces may be disposed.

There can be provided a multi-layer ceramic electronic component whereinsulation failure less occurs and a production method thereof.

These and other objects, features and advantages of the presentinvention will become more apparent in light of the following detaileddescription of best mode embodiments thereof, as illustrated in theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective diagram of a multi-layer ceramic capacitoraccording to a first embodiment of the present invention;

FIG. 2 is a plan diagram of the multi-layer ceramic capacitor;

FIG. 3 is a side diagram of the multi-layer ceramic capacitor;

FIG. 4 is an exploded perspective diagram of the multi-layer ceramiccapacitor;

FIG. 5 is a sectional diagram along an A-A′ line of the multi-layerceramic capacitor in FIG. 1;

FIG. 6 is a sectional diagram along an B-B′ line of the multi-layerceramic capacitor in FIG. 1;

FIG. 7 is a sectional diagram along an B-B′ line of the multi-layerceramic capacitor in FIG. 1;

FIG. 8 is a flow chart showing a method of producing the multi-layerceramic capacitor;

FIG. 9A is a plan diagram of a ceramic sheet used in the productionmethod;

FIG. 9B is a plan diagram of a ceramic sheet used in the productionmethod;

FIG. 9C is a plan diagram of a ceramic sheet used in the productionmethod;

FIG. 10 is a perspective diagram of a ceramic body of the multi-layerceramic capacitor;

FIG. 11A is a perspective diagram showing a process of forming anexternal electrode in the production method;

FIG. 11B is a perspective diagram showing a process of forming anexternal electrode in the production method;

FIG. 11C is a perspective diagram showing a process of forming anexternal electrode in the production method;

FIG. 12A is a sectional diagram of a multi-layer ceramic capacitoraccording to alternative embodiment 1 of the first embodiment;

FIG. 12B is a sectional diagram of a multi-layer ceramic capacitoraccording to alternative embodiment 2 of the first embodiment;

FIG. 13 is a side diagram showing a configuration example of themulti-layer ceramic capacitor according to alternative embodiments 1, 2of the first embodiment;

FIG. 14 is a perspective diagram showing the multi-layer ceramiccapacitor according to an alternative embodiment 3 of the firstembodiment;

FIG. 15 is a side diagram showing the multi-layer ceramic capacitoraccording to an alternative embodiment 3 of the first embodiment;

FIG. 16 is an exploded perspective diagram of the multi-layer ceramiccapacitor according to the alternative embodiment 3 of the firstembodiment;

FIG. 17 is an exploded perspective diagram showing a configurationexample of the multi-layer ceramic capacitor according to thealternative embodiment 3 of the first embodiment;

FIG. 18 is a perspective diagram of a multi-layer ceramic capacitoraccording to a second embodiment of the present invention;

FIG. 19 is a sectional diagram along a C-C′ line of the multi-layerceramic capacitor in FIG. 18;

FIG. 20A is a perspective diagram showing a process of producing themulti-layer ceramic capacitor;

FIG. 20B is a perspective diagram showing a process of producing themulti-layer ceramic capacitor;

FIG. 21A is a side diagram showing a multi-layer ceramic capacitoraccording to an alternative embodiment 1 of the second embodiment;

FIG. 21B is a plan diagram showing a multi-layer ceramic capacitoraccording to an alternative embodiment 1 of the second embodiment;

FIG. 22A is a side diagram showing a multi-layer ceramic capacitoraccording to an alternative embodiment 2 of the second embodiment;

FIG. 22B is a plan diagram showing a multi-layer ceramic capacitoraccording to the alternative embodiment 2 of the second embodiment.

DETAILED DESCRIPTION

Hereinafter, an embodiment of the present invention will be describedwith reference to the drawings.

In the figure, an X axis, a Y axis and a Z axis orthogonal to each otherare shown, as appropriate. The X axis, the Y axis and the Z axis arecommon in all figures.

First Embodiment Overall Configuration of Multi-Layer Ceramic Capacitor10

FIG. 1 is a perspective diagram of a multi-layer ceramic capacitor 10according to a first embodiment of the present invention. FIG. 2 is aplan diagram of the multi-layer ceramic capacitor 10. FIG. 3 is a sidediagram of the multi-layer ceramic capacitor 10.

The multi-layer ceramic capacitor 10 is a through-type (three-terminaltype) multi-layer ceramic capacitor including a ceramic body 11, firstand second end external electrodes 14 a, 14 b, and first and second sideface external electrodes 15 a, 15 b. In the multi-layer ceramiccapacitor 10, the first and second end external electrodes 14 a, 14 bconfigure an end external electrode unit, and the first and second sideface external electrodes 15 a, 15 b configure a side face externalelectrode unit acting as an opposite to the end external electrode unit.

In the multi-layer ceramic capacitor 10, the first and second endexternal electrodes 14 a, 14 b are configured as through electrodes, andthe first and second side face external electrodes 15 a, 15 b areconfigured as ground electrodes, for example. In FIG. 1, the endexternal electrodes 14 a, 14 b and the side face external electrodes 15a, 15 b are shown in dashed lines, and the ceramic body 11 is showntransparently.

The ceramic body 11 is formed in an almost rectangular parallelepipedshape having ridges extending substantially in the X axis, Y axis and Zaxis directions. The ridges of the ceramic body 11 are chamfered and areconfigured as roundish curved surfaces. The ceramic body 11 includes apair of end faces T1, T2 perpendicular to the X axis, a pair of firstside faces S1, S2 perpendicular to the Z axis, and a pair of second sidefaces S3, S4 to the Y axis. Each faces T1, T2, S1, S2, S3, S4 of theceramic body 11 may be flat or curved.

The multi-layer ceramic capacitor 10 is packaged such that the firstside face S1 or the first side face S2 is faced to a packaging face ofthe substrate, for example. The multi-layer ceramic capacitor 10 ismountable to a built-in component substrate having vias (through-holeelectrodes), for example. In this case, the first end external electrode14 a and the second end external electrode 14 b, and the first side faceexternal electrode 15 a or the second side face external electrode 15 bare connected to the vias formed on the substrate in the first side faceS1 or the first side face S2 facing to the packaging face of thebuilt-in component substrate.

The ceramic body 11 includes first and second internal electrodes 12, 13extending along an XY plane disposed alternately in the Z axisdirection. The first internal electrodes 12 are drawn to end faces T1,T2, respectively, and the second internal electrodes 13 are drawn to thesecond side faces S3, S4, respectively. The first and second internalelectrodes 12, 13 that mutually form a pair configure an internalelectrode unit of the multi-layer ceramic capacitor 10.

In the present invention, “disposed alternately” is not limited to thecase that all first and second internal electrodes 12, 13 are entirelydisposed alternately, but also may include the case that a plurality offirst internal electrodes 12 or second internal electrodes 13 aresuccessively disposed in a part of a laminate structure.

The end external electrodes 14 a, 14 b cover both ends including the endfaces T1, T2 of the ceramic body 11, and connect first internalelectrodes 12 drawn to the end faces T1, T2. The end external electrodes14 a, 14 b extend from the end faces T1, T2 to the side faces S1, S2,S3, S4, and each has a cup shape open in the X axis direction.

The side face external electrodes 15 a, 15 b are disposed at a centerarea of the ceramic body 11 in the X axis direction spaced apart fromthe end external electrodes 14 a, 14 b, and connect the second internalelectrodes 13 drawn to the second side faces S3, S4.

The side face external electrodes 15 a, 15 b cover the first side facesS1, S2 of the ceramic body 11, and go around from the first side facesS1, S2 to the second side faces S3, S4. The side face externalelectrodes 15 a, 15 b are connected each other at connection parts 15 jat a center area of the second side faces S3, S4 in the Z axisdirection. By the configuration, the side face external electrodes 15 a,15 b are successive along all side faces S1, S2, S3, S4.

FIG. 4 is an exploded perspective diagram of the ceramic body 11. FIG. 5is a sectional diagram along an A-A′ line of the multi-layer ceramiccapacitor 10 in FIG. 1. FIG. 6 is a sectional diagram along a B-B′ lineof the multi-layer ceramic capacitor 10 in FIG. 1. Although the ceramicbody 11 sintered cannot be disassembled actually, the ceramic body 11 isdisassembled in FIG. 4 for explanation convenience.

The ceramic body 11 is configured of a capacitance forming part 17 wherethe internal electrodes 12, 13 are disposed at a center area in the Zaxis direction, and covers 18, 19 sandwiching the capacitance formingpart 17 in the Z axis direction. The capacitance forming part 17 has afunction to form electrostatic capacitance. The covers 18, 19 do notform electrostatic capacitance, and has a function to mainly protect thecapacitance forming part 17.

Also, as shown in FIG. 4, the ceramic body 11 has a laminate structurewhere a plurality of ceramic layers 16 extending along an XY plane arelaminated in the Z axis direction. In the capacitance forming part 17,the ceramic layer 16 where the first internal electrode 12 is formed andthe ceramic layer 16 where the second internal electrode 13 is formedare alternately laminated. In the covers 18, 19, a plurality of theceramic layers 16 where no internal electrodes 12, 13 are formed arelaminated.

The first internal electrodes 12 are in strip shapes, and are drawn tothe end faces T1, T2 in equal widths of the faces facing to the secondinternal electrodes 13. The second internal electrodes 13 are drawn tothe second side face S3, S4 in widths narrower than the faces facing tothe first internal electrodes 12 at the center area in the X axisdirection. A lamination number of the ceramic layers 16 in thecapacitance forming part 17 and the covers 18, 19 may be determinedarbitrarily based on a performance and a shape that the multi-layerceramic capacitor 10 requires.

In the capacitance forming part 17, the first internal electrodes 12 areconnected each other by the end external electrode 14 a, 14 b, thesecond internal electrodes 13 are connected each other by the side faceexternal electrode 15 a, 15 b. Accordingly, when a voltage is appliedbetween the end external electrodes 14 a, 14 b and the side faceexternal electrodes 15 a, 15 b, the voltage is applied to the ceramiclayer 16 between the internal electrodes 12, 13. In this manner, anelectric charge corresponding to the voltage is stored in thecapacitance forming part 17.

Each ceramic layer 16 is formed of dielectric ceramics.

As the dielectric ceramics forming each ceramic layer 16, a materialmainly including barium titanate, strontium titanate, calcium titanate,magnesium titanate, calcium zirconate, calcium titanate zirconate,barium zirconate, titanium oxide or the like may be available, forexample.

Since the covers 18, 19 do not form electrostatic capacitance,dielectric ceramics forming the ceramic layer 16 of the covers 18, 19 donot need to have a high dielectric constant. Accordingly, differentdielectric ceramics may be used as the ceramic layers 16 of the covers18, 19 and the ceramic layers 16 of the capacitance forming part 17.However, from a standpoint of structural stability, it is preferablethat the same dielectric ceramics are used in the ceramic layers 16 ofthe covers 18, 19 and the ceramic layers 16 of the capacitance formingpart 17.

The internal electrodes 12, 13 are formed of a good conductor. As thegood conductor forming the internal electrodes 12, 13, metal or alloymainly including nickel, copper, palladium, platinum, silver, gold orthe like may be available, for example.

The end external electrodes 14 a, 14 b and the side face externalelectrodes 15 a, 15 b are formed of a good conductor. As the goodconductor forming the end external electrodes 14 a, 14 b and the sideface external electrodes 15 a, 15 b, metal or alloy mainly includingnickel, copper, palladium, platinum, silver, gold or the like may beavailable, for example.

The end external electrodes 14 a, 14 b and the side face externalelectrodes 15 a, 15 b may be a monolayer structure or a multi-layerstructure. The multi-layer structure may be a two-layer structure of abase film and a surface film, or a three-layer structure of a base film,an intermediate film and a surface film, for example.

The base film may be a baked film of metal or alloy mainly includingnickel, copper, palladium, platinum, silver, gold or the like may beavailable, for example.

The intermediate film may be metal or alloy mainly including platinum,palladium, gold, copper, nickel or the like may be available, forexample.

The surface film may be metal or alloy mainly including copper, tin,palladium, gold, zinc or the like may be available, for example.

In the multi-layer ceramic capacitor 10 according to the embodiment, bydisposing the connection parts 15 j to which the side face externalelectrodes 15 a, 15 b are connected on the second side faces S3, S4, thefirst side face external electrode 15 a and the second side faceexternal electrode 15 b are not overlapped beyond the ridges connectingthe first side faces S1, S2 and the second side faces S3, S4. In thismanner, it can increase the widths of the side face external electrode15 a, 15 b near the ridges during a production process.

Thus, in the multi-layer ceramic capacitor 10, as the widths of the sideface external electrode 15 a, 15 b near the ridges are not increased, itcan ensure sufficient wide distances between the end external electrodes14 a, 14 b and the side face external electrodes 15 a, 15 b.Accordingly, in the multi-layer ceramic capacitor 10, an insulationfailure less occurs for example, in a damp heat test.

In addition, the side face external electrodes 15 a, 15 b easily tend tohave uneven thicknesses in the connection part 15 j. Specifically, theconnection parts 15 j are ends of the side face external electrodes 15a, 15 b as shown in FIG. 6, and may be thin. In an opposite way, theconnection parts 15 j may be thick by overlapping the side face externalelectrodes 15 a, 15 b as shown in FIG. 7. Accordingly, the faces onwhich the connection parts 15 j are disposed easily tend to havedegraded flatness.

In this regard, in the multi-layer ceramic capacitor 10, the connectionparts 15 j are disposed not on the first side face S1, S2 that aremounting surfaces of the substrate, but on the second side faces S3, S4.That is to say, a series of the side face external electrodes 15 a, 15 bhaving a uniform thickness are disposed at the first side faces S1, S2.Thus, the side face external electrodes 15 a, 15 bs have good flatnesson the first side faces S1, S2.

In this manner, in the multi-layer ceramic capacitor 10, the flatness ofthe side face external electrodes 15 a, 15 b is kept on the first sidefaces S1, S2. Therefore, when the multi-layer ceramic capacitor 10 ismounted such that the first side faces S1, S2 are faced to the mountingsurface of the substrate, the multi-layer ceramic capacitor 10 can keepa proper attitude without tilting. In addition, in the first side faceS1 or the first side face S2, when the first side face externalelectrode 15 a or the second side face external electrode 15 b isconnected to the via of the substrate, the first side face externalelectrode 15 a or the second side face external electrode 15 b is easilyconnected.

Furthermore, an aspect ratio of dimensions of the ceramic body 11 in theX axis, Y axis and Z axis directions can be determined arbitrarily basedon a performance and a shape that the multi-layer ceramic capacitor 10requires.

In particular, the present invention is useful for a thin ceramiccapacitor 10 where the thickness of the ceramic body 11 in the Z axisdirection is 100% or less of the width in the Y axis direction. In otherwords, in the thin ceramic capacitor 10, as a go-around amount of theside face external electrodes 15 a, 15 b can be made small, the sideface external electrodes 15 a, 15 b can be easily connected. Inparticular, when the thickness of the ceramic body 11 in the Z axisdirection is 50% or less of the width in the Y axis direction, it hasbeen confirmed that an especially high manufacturing efficiency isprovided.

Similarly, the present invention is also useful for a thin ceramiccapacitor 10 where the thickness of the ceramic body 11 in the X axisdirection is 100% or less of the width of the side face externalelectrodes 15 a, 15 b in the X axis direction. In particular, when thethickness of the ceramic body 11 in the Z axis direction is 80% or lessof the width of the side face external electrodes 15 a, 15 b in the Xaxis direction, it has been confirmed that an especially highmanufacturing efficiency is provided.

[Method of Producing Multi-Layer Ceramic Capacitor 10]

FIG. 8 is a flow chart showing a method of producing the multi-layerceramic capacitor. FIGS. 9A to 11 are diagrams of a production processof the multi-layer ceramic capacitor 10. Hereinafter, the method ofproducing the multi-layer ceramic capacitor 10 will be described alongFIG. 8 referring to FIGS. 9A to 11 as appropriate.

(Step ST1: Ceramic Sheet Preparation Process)

In step ST1, an unsintered ceramic sheet 16U is prepared.

FIGS. 9A to 9C each is a plan diagram of the ceramic sheet 16U preparedin step ST1. Specifically, a ceramic sheet 16U where an unsintered firstinternal electrode 12U is formed shown in FIG. 9A, a ceramic sheet 16Uwhere an unsintered second internal electrode 13U is formed shown inFIG. 9B, and a ceramic sheet 16U where no internal electrodes 12U, 13Uare formed shown in FIG. 9C are prepared.

In order to produce the ceramic sheet 16U, a ceramic slurry is firstlyprepared. The ceramic slurry is provided by mixing dielectric ceramicspowder (e.g., barium titanate powder), a solvent (e.g., ethanol), abinder (e.g., polyvinyl butyral), and an additive (e.g., dispersant),for example.

By forming the ceramic slurry into a sheet, the ceramic sheet 16U isprovided. For the formation of the ceramic slurry, a forming machinesuch as a die coater and a gravure coater can be used, for example.

In order to form the internal electrodes 12U, 13U in the ceramic sheet16U, a metal paste is firstly prepared. The metal paste is provided bymixing metal powder (e.g., nickel powder), a solvent (e.g., terpineol),a binder (e.g., ethyl cellulose), and an additive (e.g., dispersant),for example.

Then, the metal paste is printed on the ceramic sheet 16U, therebyforming the internal electrodes 12U, 13U. For printing the metal paste,a printing apparatus such as a screen printer and a gravure printer canbe used, for example.

(Step ST2: Lamination Process)

In step ST2, the ceramic sheet 16U prepared in step ST1 is laminated inthe Z axis direction. In other words, so as to provide the configurationshown in FIG. 4, respective ceramic sheets 16U shown in FIGS. 9A to 9Care laminated and thermally compressed, thereby providing an unsinteredceramic body 11U. For the lamination of the ceramic sheets 16U, alamination apparatus such as a movable suction head can be used, forexample.

(Step ST3: Sintering Process)

In step ST3, the unsintered ceramic body 11U provided in step ST2 issintered. Specifically, the unsintered ceramic body 11U is heated andsintered. Then, the unsintered ceramic body 11U is chamfered, e.g., bybarrel polishing, thereby providing the ceramic body 11, shown in FIG.10. For the sintering of the ceramic body 11U, a sintering apparatussuch as a tunnel-type sintering furnace and a box-type sintering furnaceis used under a reduction atmosphere or a low oxygen partial pressureatmosphere, for example.

(Step ST4: External Electrode Formation Process)

In step ST4, for the ceramic body 11 provided in step ST3, the endexternal electrodes 14 a, 14 b and the side face external electrodes 15a, 15 b are formed. The end external electrodes 14 a, 14 b and the sideface external electrodes 15 a, 15 b are formed by applying an electricalconductive paste to the ceramic body 11, which is baked.

FIGS. 11A to 11C each is a perspective diagram of the ceramic body 11showing the process in step ST4.

Firstly, as shown in FIG. 11A, by applying the electrical conductivepaste to the ceramic body 11, unsintered first and second end externalelectrodes 14 aU, 14 bU are formed.

Next, as shown in FIG. 11B, by applying the electrical conductive pasteto the ceramic body 11, an unsintered first side face external electrode15 aU is formed.

Furthermore, as shown in FIG. 11C, by applying the electrical conductivepaste to the ceramic body 11, an unsintered second side face externalelectrode 15 bU is formed.

For the application of the electrical conductive paste to the ceramicbody 11, an application apparatus such as a roller applicator and a dipapplicator can be used, for example. Note that the order of theformation of the end external electrodes 14 aU, 14 bU and the side faceexternal electrodes 15 aU, 15 bU can be determined arbitrarily.

By baking the end external electrodes 14 aU, 14 bU and the side faceexternal electrodes 15 aU, 15 bU shown in FIG. 11C to the ceramic body11, the end external electrodes 14 a, 14 b and the side face externalelectrodes 15 a, 15 b are formed, thereby providing the multi-layerceramic capacitor 10 shown in FIG. 1, etc.

The end external electrodes 14 aU, 14 bU and the side face externalelectrodes 15 aU, 15 bU can be baked to the ceramic body 11 under areduction atmosphere or a low oxygen partial pressure atmosphere, forexample. Note that the end external electrodes 14 a, 14 b and the sideface external electrodes 15 a, 15 b may be a two-layer structure of thebase film that is a baked film of the electrical conductive paste and asurface film, or a three-layer structure of a base film, an intermediatefilm and the surface film, for example.

In the production method according to the embodiment, in order to formthe side face external electrodes 15 a, 15 b, the electrical conductivepaste is applied to the first side face S1 and the first side face S2 ofthe ceramic body 11. Specifically, by applying the electrical conductivepaste two times, the side face external electrodes 15 a, 15 b can beformed. According to the production method in the embodiment, the numberof applying the electrical conductive paste can be small, the productionprocess becomes simple, and misalignment of the electrical conductivepaste less occurs.

From a standpoint of the production efficiency, it is preferable thatlarge diameter ceramic sheets 16U that are not cut into pieces for aplurality of the multi-layer ceramic capacitors 10 are prepared in stepST1 (ceramic sheet preparation process), and are cut into pieces afterstep ST2 (lamination process). In the embodiment, for explanationconvenience, the ceramic sheets 16U that are cut into pieces areprepared in step ST1. However, a timing of cutting into pieces may bedetermined arbitrarily.

In the above-described embodiment, after the ceramic body 11 issintered, the end external electrodes 14 a, 14 b and the side faceexternal electrodes 15 a, 15 b are baked. However, the ceramic body 11,the end external electrodes 14 a, 14 b and the side face externalelectrodes 15 a, 15 b may be sintered at the same time.

[Multi-Layer Ceramic Capacitor 10 According to Alternative Embodiments1, 2]

FIGS. 12A and 12B are sectional diagrams of a multi-layer ceramiccapacitor 10 according to alternative embodiments 1, 2 of the firstembodiment.

In the multi-layer ceramic capacitor 10 according to the alternativeembodiment 1 shown in FIG. 12A, a go-around amount of the first sideface external electrode 15 a to the second side faces S3, S4 is greaterthan a go-around amount of the second side face external electrode 15 bto the second side faces S3, S4. In this manner, in any of the secondside faces S3, S4, the first side face external electrode 15 a isconnected to all second internal electrodes 13 not via the second sideface external electrode 15 b.

Here, suppose that there are second internal electrodes 13 onlyconnected to the first side face external electrode 15 a and the secondinternal electrodes 13 only connected to the second side face externalelectrode 15 b in the second side faces S3, S4, respectively. In thiscase, at a boundary between the first side face external electrode 15 aand the second side face external electrode 15 b, the connection betweenthe second internal electrodes 13 and the side face external electrodes15 a, 15 b may become unstable.

In this regard, in the multi-layer ceramic capacitor 10 according toalternative embodiment 1, the second internal electrodes 13 drawn to thesecond side faces S3, S4 are collectively connected by the first sideface external electrode 15 a. In this manner, the second internalelectrodes 13 and the side face external electrodes 15 a, 15 b can beconnected more reliably.

The first side face external electrode 15 a may reach the ridges thatconnect the second side faces S3, S4 and the first side face S2.However, in view of ensuring the flatness of the second side faceexternal electrode 15 b, it is not preferable that the first side faceexternal electrode 15 a reaches the first side face S2.

A multi-layer ceramic capacitor 10 according to an alternativeembodiment 2 shown in FIG. 12B has a configuration that the secondinternal electrodes 13 and the side face external electrodes 15 a, 15 bcan be connected more reliably, similar to the alternative embodiment 1.

In other words, in the multi-layer ceramic capacitor 10 according to thealternative embodiment 2, a go-around amount of the second side faceexternal electrode 15 b to the second side face S3 is greater than ago-around amount of the first side face external electrode 15 a to thesecond side face S3, dissimilar to the alternative embodiment 1. In thismanner, in the second side face S3, the second side face externalelectrode 15 b is connected to all second internal electrodes 13 not viathe first side face external electrode 15 a.

Thus, when any one of the side face external electrodes 15 a, 15 b areconnected to all second internal electrodes 13 not via the other in thesecond side faces S3, S4, the effects similar to the alternativeembodiment 1 can be provided.

Note that it is not an essential configuration that all areas where thesecond internal electrodes 13 are drawn are covered with any one of theside face external electrodes 15 a, 15 b in the second side faces S3,S4.

For example, as shown in FIG. 13, the first side face external electrode15 a may cover only the second internal electrodes 13 disposed at alowest part in the Z axis direction and at a center area in the X axisdirection, and may not cover both ends in the X axis direction. Also inthis case, the second internal electrodes 13 are collectively connectedby the first side face external electrode 15 a, whereby the secondinternal electrodes 13 and the side face external electrodes 15 a, 15 bcan be connected more reliably.

[Multi-Layer Ceramic Capacitor 10 According to Alternative Embodiment 3]

FIG. 14 is a side diagram of a multi-layer ceramic capacitor 10according to an alternative embodiment 3 of the first embodiment. FIG.15 is a side diagram of the multi-layer ceramic capacitor 10, and FIG.16 is an exploded perspective diagram of the multi-layer ceramiccapacitor 10.

In the multi-layer ceramic capacitor 10 according to the alternativeembodiment 3, the first internal electrodes 12 are drawn not to the endfaces T1, T2, but to both ends at end faces T1, T2 sides of the secondside faces S3, S4, dissimilar to the first embodiment. Specifically, thefirst internal electrodes are covered with extension parts of the endexternal electrodes 14 a, 14 b to the second side faces S3, S4.Accordingly, also in the multi-layer ceramic capacitor 10 according tothe alternative embodiment 3, the first internal electrodes 12 areconnected by the end external electrodes 14 a, 14 b.

Also in the multi-layer ceramic capacitor 10 according to thealternative embodiment 3, the effects similar to the first embodimentcan be provided.

In this way, the first internal electrodes 12 of the multi-layer ceramiccapacitor 10 may be drawn to ends at the end faces T1, T2 sides of theceramic body 11 covered by the end external electrodes 14 a, 14 b, andmay be drawn to the second side faces S3, S4.

In this case, the end external electrodes 14 a, 14 b may not cover theend faces T1, T2, but cover only the both ends of the side faces S1, S2,S3, S4 in the X axis direction. Furthermore, the end external electrode14 may cover only the area where the first internal electrodes 12 aredrawn in the second side faces S3, S4.

In addition, as shown in FIG. 17, the first internal electrodes 12 maybe drawn over both of the end faces T1, T2 and the second side faces S3,S4.

Second Embodiment

A multi-layer ceramic capacitor 10 according to a second embodiment ofthe present invention will be described. In the second embodiment,descriptions about the configurations common to those in the firstembodiment are omitted, as appropriate. As to the configurations in thesecond embodiment corresponding to those in the first embodiment,symbols similar to the first embodiment are used.

[Configuration of Multi-Layer Ceramic Capacitor 10]

FIG. 18 is a perspective diagram of the multi-layer ceramic capacitor 10according to the second embodiment. FIG. 19 is a sectional diagram alonga C-C′ line of the multi-layer ceramic capacitor 10 in FIG. 18.

The multi-layer ceramic capacitor 10 according to the second embodimentincludes third side face external electrode 15 c disposed at the secondside faces S3, S4 in a similar way to the first and second side faceexternal electrodes 15 a, 15 b. The third side face external electrode15 c has a dimension in the X axis direction similar to those of thefirst and second side face external electrodes 15 a, 15 b, and covers acenter area of the second side faces S3, S4 in the Z axis direction.

The first and second side face external electrodes 15 a, 15 b areconnected via the third side face external electrode 15 c. Specifically,on the second side faces S3, S4, the connection parts 15 j of the firstside face external electrode 15 a and the third side face externalelectrode 15 c, and the connection parts 15 j of the second side faceexternal electrode 15 b and the third side face external electrode 15 care disposed.

In the multi-layer ceramic capacitor 10 according to the secondembodiment, as a go-around amount of the first and second side faceexternal electrodes 15 a, 15 b to the second side faces S3, S4 is small,the first and second side face external electrodes 15 a, 15 b can beeasily formed.

It is also preferable that the third side face external electrode 15 ccover the capacitance forming part 17 of the ceramic body 11.Specifically, the connection parts 15 j formed on the second side facesS3, S4 are preferably disposed on the covers 18, 19. In this case, asthe second internal electrodes 13 are collectively connected only by thethird side face external electrode 15 c, the second internal electrodes13 and the side face external electrodes 15 a, 15 b, 15 c can beconnected more reliably.

[Method of Producing Multi-Layer Ceramic Capacitor 10]

A method of producing the multi-layer ceramic capacitor 10 according tothe second embodiment is common to the first embodiment as to steps ST1to ST3 shown in FIG. 8 and is different from the first embodiment onlyas to step ST4.

FIGS. 20A, 20B each is a perspective diagram of the ceramic body 11showing a process of step ST4.

Firstly, as shown in FIG. 20A, by applying the electrical conductivepaste to the ceramic body 11 where the unsintered first and second endexternal electrode 14 aU, 14 bU are formed, an unsintered third sideface external electrode 15 cU is formed.

Next, as shown in FIG. 20B, by applying the electrical conductive pasteto the ceramic body 11, an unsintered first side face external electrode15 aU is formed. Furthermore, by applying the electrical conductivepaste to the ceramic body 11, an unsintered second side face externalelectrode 15 bU is formed.

Then, by baking the ceramic body 11 to the end external electrodes 14aU, 14 bU and the side face external electrodes 15 aU, 15 bU, 15 cU, theend external electrode 14 a, 14, and the side face external electrodes15 a, 15 b, 15 c are formed, thereby providing the multi-layer ceramiccapacitor 10 as shown in FIG. 18, etc.

The third side face external electrode 15 c may be formed only at thesecond side faces S3, S4, and does not need to go around the first sideface S1, S2. Therefore, the method is not limited to bake the electricalconductive paste. By a variety of methods, the third side face externalelectrode 15 c can be formed. Examples include a vapor depositionmethod, a sputtering method, a plating method, and a printing method.

[Multi-Layer Ceramic Capacitor 10 According to Alternative Embodiment 1]

FIGS. 21A, 21B each is a multi-layer ceramic capacitor 10 according toan alternative embodiment 1 of the second embodiment. FIG. 21A is a sidediagram of the multi-layer ceramic capacitor 10, and FIG. 21B is a plandiagram of the multi-layer ceramic capacitor 10.

In the multi-layer ceramic capacitor 10 according to the alternativeembodiment 1, the third side face external electrode 15 c is formed toentirely cover the second internal electrode 13 drawn to the second sidefaces S3, S4. The third side face external electrode 15 c is formed tofit a drawn width of the second internal electrode 13 such that a widthd1 in the X axis direction is as narrow as possible.

In this manner, while a good connection between the third side faceexternal electrode 15 c and the second internal electrode 13 is kept, itbecomes possible to dispose the third side face external electrode 15 cconnected to the second internal electrode 13 sufficiently apart fromthe end external electrodes 14 a, 14 b. Thus, a short circuit caused bya creeping discharge can be prevented between the third side faceexternal electrode 15 c and end the external electrodes 14 a, 14 b, forexample.

However, when the widths of the side face external electrodes 15 a, 15b, 15 c in the X axis direction are same in the second embodiment (FIG.18, etc.), a sufficiently large area that is connected to the mountingsurface of the substrate may not be provided in the first side faceexternal electrode 15 a or the second side face external electrode 15 b.This does not allow a good connection to the mounting surface of thesubstrate in the multi-layer ceramic capacitor 10.

Then, in the multi-layer ceramic capacitor 10 according to thealternative embodiment 1, as shown in FIGS. 21A, 21B, widths d2 of thefirst side face external electrode 15 a and the second side faceexternal electrode 15 b in the X axis direction are made wider than thewidth d1 of the third side face external electrode 15 c in the X axisdirection.

The widths d2 of the first side face external electrode 15 a and thesecond side face external electrode 15 b can be measured at a centerpart of the first side faces S1, S2 in the Y axis direction. The widthd1 of the third side face external electrode 15 c can be measured at acenter of the second side faces S3, S4 in the Z axis direction.

In this manner, in the multi-layer ceramic capacitor 10 according to thealternative embodiment 1, it can ensure sufficient large areas of thefirst and second side face external electrodes 15 a, 15 b on the firstside faces S1, S2. Accordingly, by the configuration of the alternativeembodiment 1, a good connection between the multi-layer ceramiccapacitor 10 and the mounting surface of the substrate can be easilyprovided.

The widths d2 of the first side face external electrode 15 a and thesecond side face external electrode 15 b may be different. Inparticular, only one of the widths d2 of the first side face externalelectrode 15 a and the second side face external electrode 15 b may begreater than the width d1 of the third side face external electrode 15c.

For example, when the mounting surface of the substrate is determined tothe first side face S1 in advance, only the width d2 of the first sideface external electrode 15 a may be widen. In an opposite way, when themounting surface of the substrate is determined to the first side faceS2, only the width d2 of the second side face external electrode 15 bmay be widen.

Also, in the multi-layer ceramic capacitor 10 according to thealternative embodiment 1, as the first and second side face externalelectrodes 15 a, 15 b are formed over a wide range in the X axisdirection, even if the third side face external electrode 15 c is moreor less deviated in the X axis direction, it ensures a good connectionbetween the first and second side face external electrodes 15 a, 15 band the third side face external electrode 15 c. It surely provides themulti-layer ceramic capacitor 10 according to the alternative embodiment1 with high reliability.

[Multi-Layer Ceramic Capacitor 10 According to Alternative Embodiment 2]

FIG. 22A and FIG. 22B each is a diagram showing a multi-layer ceramiccapacitor 10 according to an alternative embodiment 2 of the secondembodiment. FIG. 22A is a side diagram showing the multi-layer ceramiccapacitor 10. FIG. 22B is a plan diagram showing the multi-layer ceramiccapacitor 10.

In the multi-layer ceramic capacitor 10 according to the alternativeembodiment 2, the third side face external electrode 15 c is also formedto entirely cover the second internal electrode 13 drawn to the secondside faces S3, S4. The third side face external electrode 15 c is formedto fit the drawn width of the second internal electrode 13 such that thewidth d1 in the X axis direction is as narrow as possible.

However, as in the second embodiment, when the widths of the side faceexternal electrodes 15 a, 15 b, 15 c in the X axis direction are sameand the drawn width of the second internal electrode 13 is wide, thedistances between the end external electrodes 14 a, 14 b and the sideface external electrodes 15 a, 15 b, 15 c become small for the wholecircumference. This may easily cause a short circuit between the sideface external electrodes 15 a, 15 b, 15 c and the end externalelectrodes 14 a, 14 b.

Then, in the multi-layer ceramic capacitor 10 according to analternative embodiment 2, widths d2 of the first side face externalelectrode 15 a and the second side face external electrode 15 b in the Xaxis direction are made narrower than the width d1 of the third sideface external electrode 15 c in the X axis direction.

In this manner, in the multi-layer ceramic capacitor 10 according to thealternative embodiment 2, the first and second side face externalelectrode 15 a, 15 b can be disposed sufficiently apart from the endexternal electrode 14 a, 14 b. This can prevent a short circuit betweenthe first and second side face external electrodes 15 a, 15 b and theend external electrodes 14 a, 14 b.

In particular, the multi-layer ceramic capacitor 10 according to thealternative embodiment 2 can effectively prevent a short circuit betweenthe first side face external electrode 15 a or the second side faceexternal electrode 15 b and the end external electrodes 14 a, 14 b byconduction via solder on the mounting surface of the substrate. Thisensures high reliability in the multi-layer ceramic capacitor 10.

The widths d2 of the first side face external electrode 15 a and thesecond side face external electrode 15 b may be different. Inparticular, only one of the widths d2 of the first side face externalelectrode 15 a and the second side face external electrode 15 b may benarrower than the width d1 of the third side face external electrode 15c.

For example, when the mounting surface of the substrate is determined tothe first side face S1 in advance, only the width d2 of the first sideface external electrode 15 a may be narrowed. In an opposite way, whenthe mounting surface of the substrate is determined to the first sideface S2, only the width d2 of the second side face external electrode 15b may be narrowed.

Other Embodiments

While the embodiments of the present invention have been described, thepresent invention is not limited to the above-described embodiments, andit should be appreciated that variations and modifications may be madewithout departing from the scope of the present invention.

For example, although the connection parts 15 j of the side faceexternal electrodes 15 a, 15 b are disposed at the second side faces S3,S4 to which the second internal electrodes 13 of the ceramic body 11 aredrawn, this configuration is not essential.

More specifically, the connection parts 15 j of the side face externalelectrodes 15 a, 15 b may be disposed at the first side faces S1, S2 towhich no second internal electrodes 13 are drawn, as necessary. In otherwords, the side face external electrodes 15 a, 15 b may be formed so asto go around from the second side faces S3, S4 to the first side facesS1, S2.

Also in this case, it can prevent the widths of the side face externalelectrode 15 a, 15 b from widening in the vicinity of the ridges of theceramic body 11, thereby providing the multi-layer ceramic capacitor 10where insulation failure less occurs.

Furthermore, in this case, the second internal electrodes 13 drawn tothe second side faces S3, S4 are collectively connected by the firstside face external electrode 15 a or the second side face externalelectrode 15 b. Accordingly, the second internal electrodes 13 and theside face external electrodes 15 a, 15 b can be connected more reliablynot depending on a connection mode of the side face external electrodes15 a, 15 b.

In addition, the present invention is applicable to any multi-layerceramic electronic component where side face external electrodes areformed on the whole circumference of four side faces other than themulti-layer ceramic capacitor. Examples of the multi-layer ceramicelectronic component other than the multi-layer ceramic capacitorinclude a dielectric filter, for example.

A dimension of each component (such as side face external electrode) ofthe multi-layer ceramic capacitor may be an average value provided bymeasuring 25 samples randomly taken for representing a lot. Also, thedimension of each sample may be measured by a factory microscope, or maybe read for a numerical value from an image acquired using an opticalmicroscope or a scanning electron microscope by referring to a scale. Inthis case, the dimension may be measured at a polished cross-section ofthe samples to be measured, as necessary.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. A multi-layer ceramic electronic component, comprising: a ceramic body including a pair of end faces, a pair of first side faces, and a pair of second side faces all of which are faced each other, a plurality of ceramic layers extending along a pair of the first side faces and laminating along a pair of the second side faces, and an internal electrode unit having first and second internal electrodes disposed alternately between a plurality of the ceramic layers, the first internal electrodes drawn to both ends of a pair of the end faces, and the second internal electrodes dawn to both ends of a pair of the second side faces; an end external electrode unit connected to the first internal electrodes; and a side face external electrode unit connected to the second internal electrodes and having first and second side face external electrodes that go around from one of a pair of the first and second side faces to the other and are connected directly or indirectly each other at the other.
 2. The multi-layer ceramic electronic component, according to claim 1, wherein the first and second side face external electrodes go around from a pair of the first side faces to a plurality of the second side faces, and are connected each other at a pair of the second side faces.
 3. The multi-layer ceramic electronic component, according to claim 2, wherein any one of the first and second side face external electrodes is connected to a via formed on a built-in component substrate in any one of a pair of the first side faces.
 4. The multi-layer ceramic electronic component, according to claim 2, wherein any one of the first and second side face external electrodes are connected to all of the second internal electrodes not via the other in a pair of the second side faces.
 5. The multi-layer ceramic electronic component, according to claim 3, wherein any one of the first and second side face external electrodes are connected to all of the second internal electrodes not via the other in a pair of the second side faces.
 6. The multi-layer ceramic electronic component, according to any one of claim 1, wherein the side face external electrode unit further includes a third side face external electrode that connects the first side face external electrode and the second side face external electrode.
 7. The multi-layer ceramic electronic component, according to any one of claim 2, wherein the side face external electrode unit further includes a third side face external electrode that connects the first side face external electrode and the second side face external electrode.
 8. The multi-layer ceramic electronic component, according to any one of claim 3, wherein the side face external electrode unit further includes a third side face external electrode that connects the first side face external electrode and the second side face external electrode.
 9. The multi-layer ceramic electronic component, according to claim 6, wherein the first and second side face external electrodes go around from a pair of the first side faces to a pair of the second side faces, and are connected each other at a pair of second side faces, and, the third side face external electrode is connected to the second internal electrode.
 10. The multi-layer ceramic electronic component, according to claim 9, wherein at least one of widths of the first, second, and third side face external electrodes is relatively narrow in a direction perpendicular to a pair of the end faces.
 11. The multi-layer ceramic electronic component, according to claim 10, wherein a width of the third side face external electrode is narrower than widths of the first and second side face external electrodes in a direction perpendicular to a pair of the end faces.
 12. The multi-layer ceramic electronic component, according to claim 1, wherein a thickness in a direction perpendicular to a pair of first side faces is 50% or less of a width in a direction perpendicular to a pair of the second side faces in the ceramic body.
 13. The multi-layer ceramic electronic component, according to claim 1, wherein a thickness of the ceramic body in a direction perpendicular to a pair of the first side faces is 80% or less of a width of the side face external electrode unit in a direction perpendicular to a pair of the end faces.
 14. A method of producing a multi-layer ceramic electronic component, comprising: preparing a ceramic body including a pair of end faces, a pair of first side faces, and a pair of second side faces all of which are faced each other, a plurality of ceramic layers extending along a pair of the first side faces and laminating along a pair of the second side faces, and an internal electrode unit having first and second internal electrodes disposed alternately between a plurality of the ceramic layers, the first internal electrodes drawn to both ends of a pair of the end faces, and the second internal electrodes dawn to both ends of a pair of the second side faces; and disposing an end external electrode unit connected to the first internal electrodes; and a side face external electrode unit connected to the second internal electrodes and having first and second side face external electrodes that go around from one of a pair of the first side faces to the other and are connected directly or indirectly each other at the other.
 15. The method of producing a multi-layer ceramic electronic component according to claim 14, wherein a third side face external electrode that connects the first and second side face external electrodes to the other in a pair of the first and second side faces. 